Issue Time:2023-07-03 17:25:42Author:ChipsmallSource:Chipsmall LimitedClick:260
Recently, Chipsmall Limited introduced the latest box-type resistance furnace for chip decapsulation testing to further improve the quality control capability of chips and ensure their quality and reliability. As an electronic component distributor with nearly 20 years of experience, we are committed to improving our technical capabilities and quality control capabilities to meet the needs of our customers.
The box-type resistance furnace is a high-temperature processing device with advantages such as good high-temperature uniformity, high temperature control accuracy, and easy operation, which makes chip decapsulation testing more accurate and effective. It is mainly composed of a furnace body, heating components, temperature control system, and safety system.
Chip decapsulation testing is a crucial chip analysis method that helps understand the internal structure and performance of a chip by separating it from the packaging material. The box-type resistance furnace not only provides a high-temperature environment for separating the chip from the packaging material but also aids in the removal or drying of chemicals for subsequent analyses or processing. This will significantly enhance our chip decapsulation testing efficiency and accuracy, providing customers with better quality chips and services.
Shenzhen Headquarter:
2/F,BLK. 405,Shangbu Pengji Industrial Area,Huaqiangbei,Futian,Shenzhen,China 518028
TEL.: +86-755-8981 8866
Hongkong Secretary Office:
RM 705, 7/F, Fa Yuen Commercial Building, NO.75-77, Fa Yuen Street, Kowloon, Hong Kong
TEL.:+852-6220 1873